PARMI SPI HS60 3D Solder Paste Inspection System
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Inspection Speed: 30 sq.cm/sec (High Resolution), 60 sq.cm/sec (High Speed)
Height Repeatability: 3 Sigma < 1.5 µm, on a certification target
Volume Repeatability: 3 Sigma < 3%, on a certification target
Gage R&R: Less than 10 %
Inspection Speed: 30 sq.cm/sec (High Resolution), 60 sq.cm/sec (High Speed)Height Repeatability: 3 Sigma < 1.5 µm, on a certification targetVolume Repeatability: 3 Sigma < 3%, on a certification targetGage R&R: Less than 10 %...Show More
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